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| NLAS2066 Ultra-Small Dual Single Pole, Single Throw Analog Switch with Over Voltage Tolerance The NLAS2066 is a Dual SPST (Single Pole, Single Throw) Analog Switch high performance version of the popular NLAS323. Packaged in the ultra-small US8 package. It is designed as a general analog/digital switch and can also be used to isolate USB ports. Features http://onsemi.com MARKING DIAGRAM 8 US8 US SUFFIX CASE 493 1 AH = Device Code D = Date Code 1 * * * * * * * * * * * * * * * Same Pinout as the Popular NLAS323 Excellent Performance - Maximum RDSON 15 W at 3.0 V Matching Between the Switches "1.5 W at 3.0 V 1.65 V to 5.5 V Operating Range Lower Threshold Voltages for LVTTL/CMOS Levels Ultra-Low Charge Injection v 4.8 pC at 3.0 V Low Standby Power - ICC = 1.0 nA (max) @ TA = 25C CMOS Level Compatibility OVT* (Pins 1, 3, 5, and 7) These Pins may be Subjected to 0 to +7.0 V, Regardless of Operating Voltage Allows a Short from USB Line without Damage to the Device Pb-Free Packages are Available** 8 AH D NO1 1 8 VCC COM1 2 7 IN1 IN2 3 6 COM2 Typical Applications GND 4 5 NO2 USB Isolation Cell Phones PDAs MP3s Digital Still Cameras PIN ASSIGNMENT Pin 1 2 3 4 5 6 7 8 Function NO1 COM1 IN2 GND NO2 COM2 IN1 VCC OVT Yes - Yes - Yes - Yes - Important Information * ESD Protection: * Human Body Model; > 2000 V Machine Model; > 200 V Latch-Up Maximum Rating: 200 mA *Over Voltage Tolerance (OVT) enables pins to function outside (higher) of their operating voltages, with no damage to the devices or to signal integrity. **For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. FUNCTION TABLE On/Off Enable Input L H State of Analog Switch Off On ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. (c) Semiconductor Components Industries, LLC, 2004 1 April, 2004 - Rev. 5 Publication Order Number: NLAS2066/D NLAS2066 MAXIMUM RATINGS Symbol VCC VI VO IIK IOK IO ICC IGND TSTG TL TJ qJA PD MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature under Bias Thermal Resistance (Note 1) Power Dissipation in Still Air at 85C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) VI < GND VO < GND Pins 1, 3, 5, 7 Pins 2, 6 Rating Value *0.5 to )7.0 *0.5 to )7.0 -0.5 to VCC *0.5 to )7.0 *50 *50 $50 $100 $100 *65 to )150 260 )150 250 250 Level 1 UL 94 V-0 @ 0.125 in > 2000 > 200 N/A Unit V V V mA mA mA mA mA C C C C/W mW - - V Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow 2. Tested to EIA/JESD22-A114-A 3. Tested to EIA/JESD22-A115-A 4. Tested to JESD22-C101-A RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VIO VIS TA tr, tf Positive DC Supply Voltage Digital Input Voltage (Enable) Static or Dynamic Voltage Across an Off Switch Analog Input Voltage Operating Temperature Range, All Package Types Input Rise or Fall Time (Enable Input) VCC = 3.3 V + 0.3 V VCC = 5.0 V + 0.5 V NO COM Characteristics Min 1.65 GND GND GND GND -55 0 0 Max 5.5 5.5 VCC VCC 5.5 +125 100 20 Unit V V V V C ns/V http://onsemi.com 2 NLAS2066 DEVICE JUNCTION TEMPERATURE VS. TIME TO 0.1% BOND FAILURES Junction Temperature 5C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 NORMALIZED FAILURE RATE FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130C TJ = 120C TJ = 100C TJ = 110C TJ = 90C TJ = 80C 100 TIME, YEARS 1 1 10 1000 Figure 1. Failure Rate vs. Time Junction Temperature DC CHARACTERISTICS - Digital Section (Voltages Referenced to GND) Guaranteed Max Limit Symbol VIH Parameter Minimum High- Level Input Voltage, Enable Inputs Maximum Low- Level Input Voltage, Enable Inputs Maximum Input Leakage Current, Enable Inputs Maximum Quiescent Supply Current (per package) VIN = 5.5 V or GND Condition VCC 2.3 $ 10% 2.7 $ 10% 3.0 $ 10% 5.0 $ 10% 2.3 $ 10% 2.7 $ 10% 3.0 $ 10% 5.0 $ 10% 0 V to 5.5 V 255C VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 +0.1 -40 to 855C VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 +1.0 -55 to <1255C VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.55 VCC x 0.30 VCC x 0.30 VCC x 0.30 VCC x 0.30 +1.0 Unit V VIL V IIN mA ICC Enable and VIS = VCC or GND 5.5 1.0 1.0 2.0 mA http://onsemi.com 3 NLAS2066 DC ELECTRICAL CHARACTERISTICS - Analog Section Guaranteed Max Limit Symbol RON Parameter Maximum On Resistance Condition VIN = VIH Is = 8 mA VIS = VCC to GND Is = 8 mA Is = 24 mA Is = 32 mA (Figures 2 and 3) VIN = VIH VIS = 0 to VCC Is = 8 mA Is = 8 mA Is = 24 mA Is = 32 mA VCC 2.3 2.7 3.0 4.5 2.3 2.7 3.0 4.5 2.3 2.7 3.0 4.5 5.5 255C 50 20 15 7 60 24 13.5 3.0 1.3 1.4 1.5 2.0 1.0 -40 to 855C 54 24 19 11 60 24 13.5 3.0 1.3 1.4 1.5 2.0 10 -55 to <1255C 54 24 19 11 60 24 13.5 3.0 1.3 1.4 1.5 2.0 100 Unit W RFLAT(ON) On Resistance Flatness W (Figure 5) D RON On Resistance Match Between Channels VIS = 1.4 V VIS = 1.6 V VIS = 1.8 V VIS = 2.7 V (Figures 4, 5 and 6) VIN = VIL VNO = 1.0 V, VCOM = 4.5 V or VCOM = 1.0 V and VNO 4.5 V VIN = VIL VNO = 4.5 V or 1.0 V VCOM = 1.0 V or 4.5 V W INO(OFF) Off Leakage Current nA ICOM(OFF) Off Leakage Current 5.5 1.0 10 100 nA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Guaranteed Max Limit VCC Symbol tON Parameter Turn-On Time Condition RL = 300 W, CL = 35 pF (Figures 7, 14 and 15) (V) 2.3 2.7 3.0 4.5 2.3 2.7 3.0 4.5 Min 255C Typ 8 4 3 2 8 6 5 4 Max 9 5 4 3 10 8 7 6 -40 to 855C Min Typ Max 10 7 6 5 11 9 8 7 -55 to <1255C Min Typ Max 10 7 6 5 11 9 8 7 Unit ns tOFF Turn-Off Time RL = 300 W, CL = 35 pF (Figures 7, 14 and 15) ns Typical @ 255C, VCC = 5.0 V CIN CNO or CNC CCOM(OFF) CCOM(ON) Maximum Input Capacitance, Select Input Analog I/O (Switch Off) Common I/O (Switch Off) Feedthrough (Switch Off) 3.0 10 10 10 Unit pF http://onsemi.com 4 NLAS2066 ADDITIONAL APPLICATIONS CHARACTERISTICS (Voltage Reference to GND Unless Noted) Symbol BW Parameter Maximum On-Channel -3.0 dB Bandwidth or Minimum Frequency Response Condition VIS = 0 dBm (Figure 8 and 9) VCC (V) 2.3 2.7 3.0 4.5 2.3 2.7 3.0 4.5 2.3 2.7 3.0 4.5 3.0 5.5 3.0 5.5 Typical 255C 102 175 180 186 -2.2 -0.9 -0.8 -0.4 -73 -74 -74 -75 4.8 7.4 0.19 0.06 Unit MHz VONL Maximum Feed-Through On Loss VIS = 0 dBm @ 10 kHz (Figure 8 and 9) dB VISO Off-Channel Isolation f = 100 kHz VIS = 1.0 V RMS (Figure 10 and 11) VIS = VCC to GND, FIS = 20 kHz (Figure 12) FIS = 10 Hz to 100 kHz, RL = Rgen = 600 W, CL = 50 pF (Figure 13) dB Q THD Charge Injection Enable Input to Common I/O Total Harmonic Distortion TDH + Noise pC % http://onsemi.com 5 NLAS2066 160 140 120 RON (W) 100 80 60 40 VCC = 3.0 20 0 0 1 2 3 4 5 VIS (VOLTS) VCC = 4.5 0 0 0.5 1.0 VIS (VOLTS) 1.5 2.0 VCC = 2.5 RON (W) 100 125C VCC = 2.0 150 200 -40C 25C 85C 50 Figure 2. RON vs. VCOM and VCC (@255C) Figure 3. RON vs. VCOM and Temperature, VCC = 2.0 V 30 -40C 25 20 RON (W) 15 10 5 0 0 1.0 VIS (VOLTS) 2.0 3.0 125C RON (W) 25C 85C 12 -40C 10 8 6 4 2 0 0 1.0 2.0 VIS (VOLTS) 3.0 4.0 25C 85C 125C Figure 4. RON vs. VCOM and Temperature, VCC = 2.5 V Figure 5. RON vs. VCOM and Temperature, VCC = 3.0 V 6 5 4 TIME (nS) RON (W) 3 125C 2 85C 25C -40C 35.0 30.0 25.0 20.0 15.0 10.0 tON 1 0 0 1.0 2.0 3.0 4.0 5.0 VIS (VOLTS) 5.0 tOFF 0.0 2.0 3.0 4.5 VCC (V) 5.0 5.5 Figure 6. RON vs. VCOM and Temperature, VCC = 4.5 V Figure 7. Switching Time vs. Supply Voltage, T = 255C http://onsemi.com 6 NLAS2066 0 PHASE (Degrees) -1 Bandwidth (On - Loss) 0 -1 Bandwidth (On - Loss) PHASE (Degrees) 100 BANDWIDTH (dB/Div) 0 Phase (Degrees) VCC = 3.0 V TA = 25C BANDWIDTH (dB/Div) 0 Phase (Degrees) VCC = 5.0 V TA = 25C -10 -10 0.001 0.01 0.1 1.0 10 100 300 0.001 0.01 0.1 1.0 10 100 300 FREQUENCY (MHz) FREQUENCY (MHz) Figure 8. ON Channel Bandwidth and Phase Shift Over Frequency 0 -10 0 -10 Figure 9. ON Channel Bandwidth and Phase Shift Over Frequency OFF ISOLATION (dB/Div) Off Isolation, Pin 5 and 6 OFF ISOLATION (dB/Div) Off Isolation, Pin 1 and 2 Crosstalk VCC = 3.0 V TA = 25C 0.01 0.1 1 10 100 300 Crosstalk VCC = 5.0 V TA = 25C 0.01 0.1 1 10 100 300 FREQUENCY (MHz) FREQUENCY (MHz) Figure 10. Off Isolation and Crosstalk Figure 11. Off Isolation and Crosstalk 10 8 6 4 1.0 VCC = 5.0 V DISTORTION (%) VCC = 3.0 V VPP = 3.1 V Q (pC) 2 0 0.1 VCC = 5.5 V VPP = 5.0 V -2 -4 -6 0 VCC = 3.0 V 1 2 VCOM (V) 3 4 5 0.01 0.01 0.1 1.0 FREQUENCY (MHZ) 10 Figure 12. Charge Injection vs. VCOM http://onsemi.com 7 Figure 13. THD vs. Frequency NLAS2066 TIMING INFORMATION VCC DUT VCC 0.1 mF 300 W NO COM VOUT 35 pF Output VOL tON tOFF Input 0V VOH 90% 90% 50% 50% Input Figure 14. tON/tOFF VCC DUT NO COM 35 pF 300 W VOUT Input VCC 50% 0V VOH Output 10% VOL 10% tON 50% Input tOFF Figure 15. tON/tOFF VCC 2.0 V 3.0 V 4.5 V VMI 1.0 V 1.5 V 1.5 V http://onsemi.com 8 NLAS2066 DEVICE ORDERING INFORMATION Device Nomenclature Device NLAS2066US NLAS2066USG NLAS2066UST3 NLAS2066UST3G Circuit Indicator NL NL NL NL Technology AS AS AS AS Device Function 2066 2066 2066 2066 Package Suffix US US UST3 UST3 Package Type US8 US8 (Pb-Free) US8 US8 (Pb-Free) Shipping 3,000 / Tape & Reel 3,000 / Tape & Reel 10,000 / Tape & Reel 10,000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 9 NLAS2066 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493-02 ISSUE A -X- A 8 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION "A" DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055") PER SIDE. 4. DIMENSION "B" DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSION. INTER-LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055") PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076-0.0203 MM. (300-800 "). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED 0.0508 (0.0002 "). MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC -Y- J DETAIL E B L 1 4 R S U C P G -T- SEATING PLANE D 0.10 (0.004) K M 0.10 (0.004) T N TXY V H R 0.10 TYP M F DETAIL E DIM A B C D F G H J K L M N P R S U V ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 10 NLAS2066/D |
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